Electronic Hardening Materials
The ability to disperse POSS® at the molecular level is the key to realizing physical property enhancements. For chip encapsulant applications NeuShield® chip-caps have been developed which, for the cost of a frappaccino, provide shielding against thermal neutron (cosmic radiation) induced memory loss and warm X-ray damage. For solder applications, POSS® Shield has been developed which, mitigates the formation and growth of conductive tin whiskers on electronic solder connections. If you are uncertain as to which properties can be enhanced or which POSS® are most likely to be compatible with your system, please search the POSS® e-knowledge repository or send us an e-mail or call to arrange for additional information.
Neushield®
POSS® Shield