EP0408.03.30 is a physical blend of 70% EP0408 POSS epoxy with 30% diallyetherbisphenol A. It is an excellent compatibilizer, rheological diluent and dispersant for particles, ingredients and effects.
Applications: Dual cure chemistry affording increased use temperature as well as excellent water and solvent resistance. EP0408 provides chemical and thermal stability to coatings. It can also be surface glassified to a silica-like composition. Surface glassification allows for use as a tie layer and improved mar resistance.